Method for removing contamination particles from substrates
US6805137B2 · kind B2 · utility
7Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2001 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide a method for removing contaminant particles from a substrate surface, where the method includes supporting a substrate in a face up position on a substrate support member and imparting a broadband impulse to the substrate support member in a direction that is substantially perpendicular to a surface of the substrate. The broadband impulse applied to the substrate support is calculated to be of sufficient magnitude to dislodge contamination particles from the surface of the substrate. The method further includes removing dislodged particles from an area proximate the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.