Integrated cooling substrate for extreme ultraviolet reticle
US6806006B2 · kind B2 · utility
7Cited by
8References
20Claims
0Family size
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Inventors
Key dates
| Filing date | Jul 15, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1317
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The current invention provides a method and apparatus that minimizes the destructive effects of non-reflected energy during lithography. More specifically, a cooling system is located within the mask. In one example, a cooling module is integrated into the EUV mask. The cooling module may be thermoelectric. The EUV mask comprises a substrate structure as a base for a reticle, a cooling layer, which is formed on the substrate structure and a planarizing layer deposited on the cooling layer. In another example, a cooling channel is formed within the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.