Multi-frequency power delivery system
US6806569B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mechanism is provided for delivering power to an on-die component (such as a buffer circuit). This may include a package unit having a low frequency delivery path and a high frequency delivery path and a die having the on-die component and a capacitive device each coupled in parallel between a first node and a second node. The die may further include a low frequency reception path and a high frequency reception path. The low frequency reception path may couple to the low frequency delivery path on the package unit and to the first node. The high frequency reception path may couple to the high frequency delivery path on the package unit and to the first node. The high frequency reception path may include a damping resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.