Copper pad structure
US6806578B2 · kind B2 · utility
20Cited by
18References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2000 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Mar 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure (and method) for a metallurgical structure includes a passivation layer, a via through the passivation layer extending to a metal line within the metallurgical structure, a barrier layer lining the via, a metal plug in the via above the barrier layer, the metal plug and the metal line comprising a same material, and a solder bump formed on the metal plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.