Method and apparatus for processing an array of packaged semiconductor devices
US6806725B2 · kind B2 · utility
17Cited by
13References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Feb 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.