Methods of bonding microelectronic elements
US6808958B2 · kind B2 · utility
6Cited by
20References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of electrically interconnecting microelectronic elements comprises providing a first microelectronic element having contacts with protrusions and dipping the protrusions into a layer of bonding material. At least some of the bonding material is transferred onto the contacts. The contacts are bonded to conductive features of a second microelectronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.