Patent · US Expired

Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing

US6809378B2 · kind B2 · utility

5Cited by
9References
47Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 30, 2001
Grant dateOct 26, 2004
Priority date—
Expiry dateMar 9, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/32
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.