Phillip E. Byrd
14Patents
5h-index
2Co-inventors
48Inventor score
Filing activity: Sep 3, 1998 → May 26, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6181616A | Circuits and systems for realigning data output by semiconductor testers to packet-based devices under test | Physics | 34 | Expired |
| US7143500B2 | Method to prevent damage to probe card | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7219418B2 | Method to prevent damage to probe card | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6424161B1 | Apparatus and method for testing fuses | Electricity | 7 | Expired |
| US6809378B2 | Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing | Electricity | 5 | Expired |
| US6374376B1 | Circuit, system and method for arranging data output by semiconductor testers to packet-based devices under test | Physics | 5 | Expired |
| US6819132B2 | Method to prevent damage to probe card | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6762608B2 | Apparatus and method for testing fuses | Electricity | 5 | Expired |
| US6410352B2 | Apparatus and method for testing fuses | Electricity | 4 | Expired |
| US6897672B2 | Apparatus to prevent damage to probe card | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7116124B2 | Apparatus to prevent damage to probe card | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6760871B2 | Circuit, system and method for arranging data output by semiconductor testers to packet-based devices under test | Physics | 0 | Expired |
| US6819161B2 | Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing | Electricity | 0 | Expired |
| US6981199B2 | Method for arranging data output by semiconductor testers to packet-based devices under test | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.