Polishing composition containing conducting polymer
US6811474B2 · kind B2 · utility
10Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jul 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10 S/cm to about 106 S/cm, and (c) a liquid carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.