Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
US6811657B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 27, 2003 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jan 27, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for measuring the erosion profile of a metallic target in a sputtering device are provided by inserting a thin sensor into a gap between the target and a substrate pedestal. The sensor is configured to emit an energy beam toward the surface of the target and detect a reflection of the energy beam. The sensor may comprise a source element configured to emit a collimated light beam and a plurality of detectors arranged in a linear array. The sensor may also comprise optical fibers configured to reduce the size of the sensor. The detectors are positioned relative to the source element so that one of the detectors in the array will be illuminated by a reflection of the collimated light beam. The distance from the sensor to the target may be derived from the position of the detector illuminated by the reflected beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.