Filling small dimension vias using supercritical carbon dioxide
US6812132B2 · kind B2 · utility
38Cited by
3References
22Claims
0Family size
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Key dates
| Filing date | Mar 21, 2003 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76808
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Suitable particles may be deposited within an extremely small high-aspect ratio via by flowing the particles in a suspension using supercritical carbon dioxide. The particles may be made up of diblock copolymers or silesquioxane-based materials or oligomers of phobic homopolymers or pre-formed silica-based particles stabilized using diblock copolymers and may include chemical initiators to permit in situ polymerization within the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.