LED device and manufacturing method thereof
US6812481B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 30, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Aug 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light emitting element. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lea…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.