Heat treating method and heat treating device
US6814572B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Sep 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02271
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermal processing unit of the present invention includes: a reaction container which an object to be processed is conveyed into and from; a process-gas introducing part for introducing a process gas into the reaction container; a replacement-gas introducing part for introducing a replacement gas into the reaction container, the replacement-gas introducing part being independent of the process-gas introducing part; and a discharging part for discharging a gas in the reaction container. A controlling part is connected to the process-gas introducing part, the replacement-gas introducing part and the discharging part. The controlling part is adapted to control the discharging part so as to lower a pressure in the reaction container lower than a pressure at a thermal process, then control the process-gas introducing part and the replacement-gas introducing part so as to stop introducing the process gas and introduce the replacement gas into the reaction container as well as control the discharging part so as to raise the pressure in the reaction container higher than the pressure at the thermal process, and then control the discharging part so as to lower the pressure in the reaction…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.