Copper metal structure for the reduction of intra-metal capacitance
US6815823B2 · kind B2 · utility
6Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Oct 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method and structure is provided for the creation of interconnect lines. The cross section of the interconnect lines of the invention, taken in a plane that is perpendicular to the longitudinal direction of the interconnect lines, is a triangle as opposed to the conventional square or rectangular cross section of interconnect lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.