Young Way Teh
25Patents
8h-index
63Co-inventors
78Inventor score
Filing activity: Nov 27, 2000 → Jun 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7759206B2 | Methods of forming semiconductor devices using embedded L-shape spacers | Electricity | 116 | Expired |
| US7867835B2 | Integrated circuit system for suppressing short channel effects | Electricity | 115 | Active |
| US6406975B1 | Method for fabricating an air gap shallow trench isolation (STI) structure | Electricity | 51 | Expired |
| US6380106B1 | Method for fabricating an air gap metallization scheme that reduces inter-metal capacitance of interconnect structures | Electricity | 34 | Expired |
| US6649517B2 | Copper metal structure for the reduction of intra-metal capacitance | Electricity | 19 | Expired |
| US7297584B2 | Methods of fabricating semiconductor devices having a dual stress liner | Electricity | 17 | Expired |
| US7256084B2 | Composite stress spacer | Electricity | 12 | Expired |
| US7445978B2 | Method to remove spacer after salicidation to enhance contact etch stop liner stress on MOS | Electricity | 11 | Expired |
| US7785950B2 | Dual stress memory technique method and related structure | Electricity | 7 | Active |
| US6815823B2 | Copper metal structure for the reduction of intra-metal capacitance | Electricity | 6 | Expired |
| US8624329B2 | Spacer-less low-K dielectric processes | Electricity | 5 | Active |
| US7531401B2 | Method for improved fabrication of a semiconductor using a stress proximity technique process | Emerging Cross-Sectional Technologies | 5 | Active |
| US7883953B2 | Method for transistor fabrication with optimized performance | Electricity | 4 | Active |
| US7993997B2 | Poly profile engineering to modulate spacer induced stress for device enhancement | Electricity | 3 | Active |
| US7999325B2 | Method to remove spacer after salicidation to enhance contact etch stop liner stress on MOS | Electricity | 3 | Active |
| US7615427B2 | Spacer-less low-k dielectric processes | Electricity | 3 | Active |
| US7977185B2 | Method and apparatus for post silicide spacer removal | Electricity | 3 | Expired |
| US7307320B2 | Differential mechanical stress-producing regions for integrated circuit field effect transistors | Electricity | 2 | Expired |
| US8563394B2 | Integrated circuit structure having substantially planar N-P step height and methods of forming | Electricity | 2 | Active |
| US8853796B2 | High-K metal gate device | Electricity | 0 | Active |
| US8461009B2 | Spacer and process to enhance the strain in the channel with stress liner | Electricity | 0 | Active |
| US12266702B2 | Flash memory devices with thickened source/drain silicide | Electricity | 0 | Active |
| US8664717B2 | Semiconductor device with an oversized local contact as a Faraday shield | Electricity | 0 | Active |
| US8519445B2 | Poly profile engineering to modulate spacer induced stress for device enhancement | Electricity | 0 | Active |
| US8106462B2 | Balancing NFET and PFET performance using straining layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.