Single sided adhesive tape for compound diversion on BOC substrates
US6815835B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | May 16, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive system and a method of adhesion for a ball grid array semi-conductor device package facilitate the encapsulation of a die attached to a circuit board. A material is added between a die and a circuit board tape, and is oriented perpendicular to a conventional two-piece rape system used to attach the die to the circuit board. The material, which is located across from a gate through which an encapsulation compound is injected to form a package, acts as a diversion dam. The material thereby enables the injected encapsulation compound to fill a wirebond slot last and avoid an overflow which might otherwise damage the ball grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.