Integrated circuit internal heating system and method therefor
US6815965B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2000 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Apr 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Substrate removal for analysis of a semiconductor die is enhanced via a method and system for heating the die. According to an example embodiment of the present invention, a plurality of heating elements are formed in a semiconductor die. The die is operated while at least one of the plurality of heating elements heats a portion of the die adjacent the heating element. A response to the heating is detected and used to analyze the die. The present invention makes possible selective heating of the die in a manner that is readily controllable and implemented. Die analysis, including, for example, critical timing path analysis, is enhanced by this ability to controllably heat the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.