David H. Eppes
15Patents
4h-index
16Co-inventors
53Inventor score
Filing activity: Mar 8, 2000 → May 21, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6488405B1 | Flip chip defect analysis using liquid crystal | Physics | 107 | Expired |
| US6546513B1 | Data processing device test apparatus and method therefor | Physics | 8 | Expired |
| US6879172B1 | Integrated circuit heating system and method therefor | Physics | 7 | Expired |
| US7091621B1 | Crack resistant scribe line monitor structure and method for making the same | Electricity | 5 | Expired |
| US6700659B1 | Semiconductor analysis arrangement and method therefor | Physics | 3 | Expired |
| US6815965B1 | Integrated circuit internal heating system and method therefor | Electricity | 2 | Expired |
| US6599762B1 | Defect detection using liquid crystal and internal heat source | Physics | 2 | Expired |
| US6836132B1 | High resolution heat exchange | Physics | 2 | Expired |
| US6635839B1 | Semiconductor analysis arrangement and method therefor | Physics | 2 | Expired |
| US7259458B2 | Integrated circuit with increased heat transfer | Electricity | 2 | Expired |
| US9318464B2 | Variable temperature solders for multi-chip module packaging and repackaging | Electricity | 2 | Active |
| US6576195B1 | Time-lapsed IC defect analysis using liquid crystal | Physics | 1 | Expired |
| US6956385B1 | Integrated circuit defect analysis using liquid crystal | Electricity | 1 | Expired |
| US6870379B1 | Indirect stimulation of an integrated circuit die | Physics | 1 | Expired |
| US6844928B1 | Fiber optic semiconductor analysis arrangement and method therefor | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.