Microwave plasma processing device, plasma processing method, and microwave radiating member
US6818852B2 · kind B2 · utility
18Cited by
3References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32192
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A placement stage (24) on which a semiconductor wafer (W) is place is provided within a processing container (22). A microwave is generated by a microwave generator (76), and the microwave is introduced into a process container (22) through a flat antenna member (66). The flat antenna member (66) has a plurality of slots (84) arranged along a plurality of circumferences, and the plurality of circumferences are non-concentric to each other. A distribution of plasma density in the flat antenna member (66) in a radial direction is uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.