Exposed lead QFP package fabricated through the use of a partial saw process
US6818973B1 · kind B1 · utility
124Cited by
165References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 9, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Sep 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A QFP exposed pad package which includes leads exposed within the bottom surface of the package body of the package in addition to those gull-wing leads protruding from the sides of the package body. Those leads exposed within the bottom surface of the package body are created through the utilization of a standard leadframe with additional lead features that are electrically isolated subsequent to a molding process through the use of a partial saw method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.