Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
US6819161B2 · kind B2 · utility
0Cited by
10References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Oct 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/32
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.