Anode and anode chamber for copper electroplating

US6821407B1 · kind B1 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Jonathan D. Reid · Sherwood, US
• Timothy M. Archer · Lake Oswego, US
• Thomas Tan Vu · San Jose, US
• Seshasayee Varadarajan · Lake Oswego, US
• Jon Henri · West Linn, US
• Steven T. Mayer · Lake Oswego, US
• David Sauer · Horseheads, US
• Anita Kang · Portland, US
• Gerald Feldewerth · Spokane, US

Key dates

• Filing date: Aug 27, 2002
• Grant date: Nov 23, 2004
• Expiry date: Apr 11, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/241
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.