Gerald Feldewerth
4Patents
4h-index
22Co-inventors
50Inventor score
Filing activity: Nov 14, 1994 → Mar 29, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6821407B1 | Anode and anode chamber for copper electroplating | Electricity | 69 | Expired |
| US6030514A | Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor | Chemistry; Metallurgy | 29 | Expired |
| US7064446B2 | Under bump metallization layer to enable use of high tin content solder bumps | Electricity | 15 | Expired |
| US5513834A | Preparation of high purity elements | Chemistry; Metallurgy | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.