Area-array device assembly with pre-applied underfill layers on printed wiring board
US6821878B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2003 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Feb 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a method of attaching an area-array device such as a bumped flip chip to an electrical substrate. An underfill material is applied to a portion of the electrical substrate, and the underfill material is heated to an underfill-material staging temperature. A bumped area-array device is provided, the bumped area-array device including an interconnection surface and a plurality of connective bumps extending from the interconnection surface. The interconnection surface of the bumped area-array device is positioned adjacent the applied underfill material. The bumped area-array device is heated to electrically connect the connective bumps to the electrical substrate. The invention also provides a flip-chip assembly and a printed wiring board panel with pre-applied underfill material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.