Electroless plating system

US6824612B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Joseph Stevens · San Jose, US
• Dmitry Lubomirsky · Cupertino, US
• Ian Pancham · San Francisco, US
• Donald Olgado · Mountain View, US
• Howard Grunes · Santa Cruz, US
• Yeuk-Fai Edwin Mok · Santa Clara, US
• Girish Dixit · San Jose, US

Key dates

• Filing date: Dec 26, 2001
• Grant date: Nov 30, 2004
• Expiry date: Aug 26, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6723
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.