Connection components with anisotropic conductive material interconnection
US6825552B2 · kind B2 · utility
45Cited by
42References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2002 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.