Automated wafer defect inspection system and a process of performing such inspection
US6826298B1 · kind B1 · utility
21Cited by
15References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2000 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Apr 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.