Multi-layered interconnect structure using liquid crystalline polymer dielectric
US6826830B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Apr 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.