Optoelectronic package structure and process for planar passive optical and optoelectronic devices
US6827505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Apr 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.