Processing apparatus, processing system and processing method
US6827814B2 · kind B2 · utility
20Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2001 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Jul 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An edge remover is provided in the vicinity of an edge portion of a wafer subjected to copper plating. An aqueous hydrogen peroxide is supplied to the edge portion of the wafer from a first nozzle provided at an inner side for a radial direction of the wafer. Next, diluted hydrofluoric acid is supplied to the edge portion of the wafer from a second nozzle provided at an outer side for the radial direction thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.