Plating bath analysis
US6827839B2 · kind B2 · utility
17Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2001 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Sep 26, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.