Patent · US Expired

Flexible lead structures and methods of making same

US6828668B2 · kind B2 · utility

134Cited by
87References
66Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 2002
Grant dateDec 7, 2004
Priority date—
Expiry dateNov 7, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/15311
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An interconnect component comprises a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through the compliant layer. The first ends extend generally parallel to said first surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.