Integrated surface metrology
US6829054B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Sep 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention is an instrument adaptable for integration into a process tool the combines a number of instruments for surface characterization. As an integrated process monitor, the invention is capable of monitoring surface dishing, surface erosion and thickness of residue layers on work-pieces with little time delay. The invention is adaptable to making measurements while a wafer or work-piece is either wet or dry. A preferred embodiment includes an integrated optical profiler adapted to surface profiling in the presence of optical interference arising from retro-reflections from underlying optical non-uniformities Alternate embodiments include an integrated stylus profiler with vibration isolation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.