Integrated method for release and passivation of MEMS structures
US6830950B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2002 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Nov 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y30/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed herein is a method of improving the adhesion of a hydrophobic self-assembled monolayer (SAM) coating to a surface of a MEMS structure, for the purpose of preventing stiction. The method comprises pretreating surfaces of the MEMS structure with a plasma generated from a source gas comprising oxygen and, optionally, hydrogen. The treatment oxidizes the surfaces, which are then reacted with hydrogen to form bonded OH groups on the surfaces. The hydrogen source may be present as part of the plasma source gas, so that the bonded OH groups are created during treatment of the surfaces with the plasma. Also disclosed herein is an integrated method for release and passivation of MEMS structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.