Removing sacrificial material by thermal decomposition
US6833320B2 · kind B2 · utility
9Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Nov 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76808
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally decomposable sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The thermally decomposable sacrificial material may be removed without damaging or removing the dielectric layer. The thermally decomposable sacrificial material may be a combination of organic and inorganic materials, such as a hydrocarbon-siloxane polymer hybrid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.