Process and device for cleaning a semiconductor wafer

US6833324B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Grit Bonsdorf · Dresden, DE
• Wolfgang Dickenscheid · Dresden, DE

Key dates

• Filing date: Apr 25, 2003
• Grant date: Dec 21, 2004
• Expiry date: Apr 25, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A surface of a semiconductor wafer is cleaned following a chemical mechanical polishing process. With the semiconductor wafer rotating continuously, an integrated process sequence is used to etch the surface, rinse the surface, and they dry the surface. The apparatus for cleaning the semiconductor wafer has a turntable in a process chamber for rotating the wafer, a feed for cleaning medium, and a return.