Grit Bonsdorf
3Patents
2h-index
12Co-inventors
37Inventor score
Filing activity: Apr 25, 2003 → Nov 13, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7785935B2 | Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device | Electricity | 2 | Active |
| US7157381B2 | Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits | Electricity | 2 | Expired |
| US6833324B2 | Process and device for cleaning a semiconductor wafer | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.