Three-dimensional integrated CMOS-MEMS device and process for making the same
US6835589B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Nov 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by which it is connected to a substrate. The chip is attached to the MEMS substrate in a direction normal to the substrate surface, so as to make a conductive path from the chip to the MEMS. The chip may be attached by bonding the conductor to C4 metal pads formed on the chip, or by bonding the conductor to metal studs on the chip. The MEMS substrate may be thinned before attachment to the chip, or may be removed from the underside of the MEMS. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.