ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES
US6835898B2 · kind B2 · utility
150Cited by
57References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2000 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Jan 24, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.