Chemical mechanical polisher with grooved belt
US6837779B2 · kind B2 · utility
16Cited by
21References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2001 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jul 8, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt has a polishing surface to contact at least a portion of the substrate held by the substrate holder. The polishing belt is movable in a first direction in a generally linear path relative to the substrate. The polishing belt has a plurality of grooves formed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.