Asymmetric rotating sidewall magnet ring for magnetron sputtering
US6837975B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Aug 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A magnetron system for a sputtering target having an annular vault facing the wafer to be coated and having inner and outer sidewalls and a roof. A small magnetron is positioned over the roof. A first magnet assembly having a first magnet polarity along the target axis is positioned behind the inner sidewall. A second magnet assembly having an opposed second opposed magnetic polarity is disposed in back of the outer sidewall and has magnetic strength much greater than the first magnet assembly but its strength is asymmetrically distributed about the target axis. The second magnet assembly and the roof assembly are rotated together about the target axis. The rotating asymmetric sidewall magnet assembly may also be used with a hollow-cathode target, with or without a roof magnetron.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.