Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US6837983B2 · kind B2 · utility
11Cited by
94References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jul 30, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods for detecting the endpoint of a polishing step. In general, an electropolishing system is provided with a power supply configured to deliver a current through an electrolytic solution. Signal characteristics of the signal provided by the power supply are monitored to determine a polishing endpoint. Illustratively, the monitored signal characteristics include current and voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.