CMOS device structure with improved PFET gate electrode
US6838695B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jan 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure includes a substrate, a dielectric layer disposed on the substrate, first and second stacks disposed on the dielectric layer. The first stack includes a first silicon layer disposed on the dielectric layer, a silicon germanium layer disposed on the first silicon layer, a second silicon layer disposed on the silicon germanium layer, and a third silicon layer disposed on the second silicon layer. The second stack includes a first silicon layer disposed on the dielectric layer, and a second silicon layer disposed on the first silicon layer. Alternatively, the silicon germanium layer includes Boron.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.