Saw and etch singulation method for a chip package
US6841414B1 · kind B1 · utility
51Cited by
87References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2002 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Mar 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.