Monitoring apparatus and method particularly useful in photolithographically processing substrates
US6842220B1 · kind B1 · utility
11Cited by
45References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2000 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Mar 1, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8867
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for in process monitoring of the parameters of a substrate undergoing a processing within a photolithography tools arrangement which includes substrate loading and unloading stations, and substrate coating, exposure and developing stations. The method includes the step of supplying the substrate after being developed to a monitoring station and analyzing the monitoring data to estimate the photolithography process to be used for controlling thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.