Patent · US Expired

Method of forming ruthenium and ruthenium oxide films on a semiconductor structure

US6844261B2 · kind B2 · utility

17Cited by
25References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 17, 2002
Grant dateJan 18, 2005
Priority date
Expiry dateDec 17, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S427/101
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the present invention include a ruthenium precursor compound and a solvent capable of solubilizing the ruthenium precursor compound. A method is further provided for making a vaporized ruthenium precursor for use in the chemical vapor deposition of ruthenium and ruthenium-containing materials onto substrates, wherein a ruthenium precursor formulation having a ruthenium-containing precursor compound and a solvent capable of solubilizing the ruthenium-containing precursor compound is vaporized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.