Patent · US Expired

Semiconductor chip

US6845027B2 · kind B2 · utility

69Cited by

5References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Albrecht Mayer · Deisenhofen, DE
Andreas Wenzel · Munich, DE

Key dates

Filing date	Dec 30, 2002
Grant date	Jan 18, 2005
Priority date	—
Expiry date	Jan 19, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip is characterized in that some of the contact points for connecting the semiconductor chip to other components of a system that contains the chip is provided for making a connection with another semiconductor chip that can be mounted onto the first semiconductor chip and that enhances the functions and/or the power of the latter. Such a configuration allows a small semiconductor chip to be produced in a cost-effective manner, using minimal resources and the chip can be enhanced by any number of modules, without modifying the characteristics of the system, in which it is contained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.