Method and apparatus for electroless deposition with temperature-controlled chuck
US6846519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Sep 13, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1682
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The method for electroless deposition of a coating material, which may be a metal, semiconductor, or dielectric, that is carried out at a relatively low temperature of the working solution compensated by an increased temperature on the substrate which is controlled by a heater built into the substrate chuck. A decrease in the temperature of the working solution prevents thermal decomposition of the solution and reduces formation of gas bubbles, normally generated at increased temperatures. Accumulation of bubbles on the surface of the substrate is further prevented due to upwardly-facing orientation of the treated surface of the substrate. The substrate holder is equipped with a substrate heater and a substrate cooler, that can be used alternatingly for quick heating or cooling of the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.