Artur Kolics
60Patents
11h-index
56Co-inventors
77Inventor score
Filing activity: Mar 22, 2002 → Nov 21, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9778561B2 | Vacuum-integrated hardmask processes and apparatus | Electricity | 349 | Active |
| US6913651B2 | Apparatus and method for electroless deposition of materials on semiconductor substrates | Electricity | 35 | Expired |
| US9837312B1 | Atomic layer etching for enhanced bottom-up feature fill | Electricity | 30 | Active |
| US6902605B2 | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper | Electricity | 29 | Expired |
| US6794288B1 | Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation | Electricity | 28 | Expired |
| US10831096B2 | Vacuum-integrated hardmask processes and apparatus | Electricity | 22 | Active |
| US10514598B2 | Vacuum-integrated hardmask processes and apparatus | Electricity | 20 | Active |
| US7226856B1 | Nano-electrode-array for integrated circuit interconnects | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6908512B2 | Temperature-controlled substrate holder for processing in fluids | Electricity | 15 | Expired |
| US8404626B2 | Post-deposition cleaning methods and formulations for substrates with cap layers | Chemistry; Metallurgy | 15 | Active |
| US6911067B2 | Solution composition and method for electroless deposition of coatings free of alkali metals | Chemistry; Metallurgy | 14 | Expired |
| US11209729B2 | Vacuum-integrated hardmask processes and apparatus | Electricity | 11 | Active |
| US10049921B2 | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor | Electricity | 11 | Active |
| US9583386B2 | Interlevel conductor pre-fill utilizing selective barrier deposition | Electricity | 9 | Active |
| US8736055B2 | Methods and layers for metallization | Electricity | 8 | Active |
| US6846519B2 | Method and apparatus for electroless deposition with temperature-controlled chuck | Chemistry; Metallurgy | 7 | Expired |
| US9287183B1 | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch | Electricity | 7 | Active |
| US6875691B2 | Temperature control sequence of electroless plating baths | Electricity | 7 | Expired |
| US10262943B2 | Interlevel conductor pre-fill utilizing selective barrier deposition | Electricity | 6 | Active |
| US8906446B2 | Apparatus and method for electroless deposition of materials on semiconductor substrates | Electricity | 4 | Active |
| US9768063B1 | Dual damascene fill | Electricity | 4 | Active |
| US9048088B2 | Processes and solutions for substrate cleaning and electroless deposition | Chemistry; Metallurgy | 4 | Active |
| US7883739B2 | Method for strengthening adhesion between dielectric layers formed adjacent to metal layers | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8980746B2 | Adhesion layer for through silicon via metallization | Electricity | 3 | Active |
| US9382627B2 | Methods and materials for anchoring gapfill metals | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.