Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process
US6846690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Dec 29, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/5825
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.